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Thermal Management Silicones for Electronics - Curing Silicone Compound
- SilCool* Silicone Adhesive-Addition Cure
- SilCool* Silicone Grease Compounds
- Silicone Adhesive-Condensation Cure
- Thermal Conductive Encapsulants & Potting Compounds
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Thermal Management Silicones for Electronics
Thermal Management Solutions from Momentive Performane Materials
Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. |
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Grade : XE13-B5320 |
| Description : |
| E11-B5320 is a one-component paste, alkoxy cure, thermally conductive silicone adhesive sealant. This product cures at room temperature by reacting with moisture in the air to form an elastomericrubber. XE11-B5320 silicone adhesive typically offers primerless adhesion to many substrates such as most metals, plastics, ceramics and glass without the use of a primer.
XE11-B5320 silicone adhesive is non-corrosive to metals and may be suitable for electrical/electronic applications. Typical applications for XE11-B5320 silicone adhesive include sealing and bonding for thermally conductive applications such as heat generating elements, regulators and rectifiers. |
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