Thermal Management Silicones for Electronics

- Curing Silicone Compound
- SilCool* Silicone Adhesive-Addition Cure
- SilCool* Silicone Grease Compounds
- Silicone Adhesive-Condensation Cure
- Thermal Conductive Encapsulants & Potting Compounds

Thermal Management Silicones for Electronics

Thermal Management Solutions from Momentive Performane Materials Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation.

Silicone Adhesive-Condensation Cure
Momentive Performance Materials offers a range of condensation cure adhesive & Sealant that deliver thermal conductive performance. These materials cure to form an elastic rubber when exposed to asmospheric moisture at room temperatures, eliminating the need for heat ovens. The result is unique combination of process efficiency and excellent thermal conductivity. Our condensation-cure adhesives and sealants are commonly applied in board assembly and sensor applications that require moderate thermal management performance and ease of use.

Grade Cure
Chemistry		 Feature Price
TIA0220 N/A High thermal conductivity, strong adhesion. Enquiry
TIA0260 N/A High thermal conductivity, strong adhesion Enquiry
XE13-B5320 N/A Fast tack free time, UL certified Enquiry