Thermal Management Silicones for Electronics

- Curing Silicone Compound
- SilCool* Silicone Adhesive-Addition Cure
- SilCool* Silicone Grease Compounds
- Silicone Adhesive-Condensation Cure
- Thermal Conductive Encapsulants & Potting Compounds

Thermal Management Silicones for Electronics

Thermal Management Solutions from Momentive Performane Materials Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation.

Curing Silicone Compound
Momentive\'s Curable Thermally Conductive Silicone Compounds cure upon exposure to asmospheric moisture to form a cured exterior surface, while maintaining a pasty consistency in the interior. These materials provide the combined benefit of low thermal resistance and repairability of thermal greases, and low bleed and volatile contents of curable thermal materials, and help contribute to the stability of the thermal interface under harsh operating conditions.

Grade Cure
Chemistry		 Feature Price
TIS380C N/A 1 Part condensation cure Enquiry
TIS480C-L N/A 1 Part Condensation Cure Enquiry