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Thermal Management Silicones for Electronics - Curing Silicone Compound
- SilCool* Silicone Adhesive-Addition Cure
- SilCool* Silicone Grease Compounds
- Silicone Adhesive-Condensation Cure
- Thermal Conductive Encapsulants & Potting Compounds
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Thermal Management Silicones for Electronics
Thermal Management Solutions from Momentive Performane Materials
Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation. |
| SilCool* Silicone Adhesive-Addition Cure |
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| The SilCool series silicone adhesive from Momentive Performance Materials offer 1 part, heat curable materials that bond well to a wide varieties of substrates without the need for primers. They help deliver outstanding thermal conductivity, low thermal resistance, excellent dielectric properties and low stress. SilCool adhesives are excellent candidates for addressing the heat management challenges arising from the high frequencies, power, and miniaturization in today’s electronic devices, Designed to efficiently conduct heat, these material are value additions to semiconductor packages that incorporate heat-generating chips, heat spreaders, and heat sinks. |
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