Thermal Management Silicones for Electronics

- Curing Silicone Compound
- SilCool* Silicone Adhesive-Addition Cure
- SilCool* Silicone Grease Compounds
- Silicone Adhesive-Condensation Cure
- Thermal Conductive Encapsulants & Potting Compounds

Thermal Management Silicones for Electronics

Thermal Management Solutions from Momentive Performane Materials Long-term, reliable protection of sensitive electronic components is essential to many electronic applications today. Increasingly small systems and rising circuit densities have resulted in hotter operating temperatures, and driven demand for high-performance solutions for heat dissipation.
Grade : TIG210BX
Description :
TIG210BX is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss at elevated temperatures, which contributes to stability of the TIM interface under broad operational temperature ranges.