Silicone Materials for Electronic Devices and Component Assemblies

- Adhesives & Sealants
- Coating Materials
- Encapsulant and Potting Materials

Silicone Materials for Electronic Devices and Component Assemblies

The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades.

Grade : TSE326
Description :
TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suitable for assembly and gasketing where a flowable consistency is required. TSE 326 requires a minimum cure temperature of 100C and offers very low linear shrinkage and an improved thermal conductivity of 0.29 W/m K. Reddish brown in color.