Silicone Materials for Electronic Devices and Component Assemblies

- Adhesives & Sealants
- Coating Materials
- Encapsulant and Potting Materials

Silicone Materials for Electronic Devices and Component Assemblies

The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades.

Encapsulant and Potting Materials
Silicone Rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and performance, many if which offer enhancement for thermal cycling protection, stress relief, material strength, flame retardancy, or opticalclarity.

Grade Cure
Chemistry		 Feature Price
FRV138 Heat Soft Fluorosilicone encapsulant. Enquiry
RTV11 Condensation General purpose encapsulation and potting. FDA compliant. Enquiry
RTV110 series Alkoxy General purpose coating / encapsulant. FDA, USDA, & NSF compliant. Mil Spec. Enquiry
RTV116 Acetoxy Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec. Enquiry
RTV160 Alkoxy UL certified encapsulant. Enquiry
RTV31 Condensation High temperature resistant potting. Good release properties. Enquiry
RTV566 Condensation Low volatile, high temperature-resistance. Enquiry
RTV60 Condensation Extreme high temperature-resistant coating /potting. Release capability. Enquiry
RTV6136-D1 Heat Low viscosity potting gel with fast cure at low temperatures. Enquiry
RTV615 Heat High strength potting material. Fast cure at elevated temperatures. Enquiry
TN3705 Alkoxy Low volatile, low viscosity potting / coating material Enquiry
TSE3032 Heat Transparent potting / encapsulant with excellent release properties. Enquiry
TSE3033 Heat Low viscosity, transparent potting material. Fast cure at elevated temperatures. Enquiry
TSE3051 Heat Low viscosity potting gel. Enquiry
TSE3051-FR Heat UL certified variant of TSE3051 Enquiry
TSE3051-L Heat Low penetration variant of TSE3051 Enquiry
TSE3062 Heat Fast cure at low temperatures. Enquiry
TSE3070 Heat High-elongation gel with low temperature cure. Enquiry
TSE325 Heat Flowable coating / encapsulant Enquiry
TSE325-B Heat Flowable coating / encapsulant Enquiry
TSE3250 Heat Flowable coating / encapsulant. Enquiry
TSE3331 Heat UL certified, thermally conductive, coating / encaplulant. Enquiry
TSE3331K Heat Low viscosity variant of TSE3331 Enquiry
TSE3331K EX Heat Low viscosity variant of TSE3331 Enquiry
TSE3431 Heat UL certified, thermally conductive potting material. Release capability Enquiry
TSE3431-H Heat UL certified, thermally conductive potting material. Release capability Enquiry
TSE3661 Condensation Flowable encapsulant / potting material. Enquiry
TSE3663 Condensation Flowable encapsulant / potting material Enquiry
TSE3664K Condensation UL certified, flowable encapsulant / potting material. Enquiry
TSE398 Alkoxy Pourable coating / encapsulant Enquiry
XE11-A5133S Alkoxy Low volatile, UL certified, thermally conductive coating & potting. Enquiry
XE14-B7892 Heat UL certified low-viscosity potting material. Low temperature cure. Release capability. Enquiry
YE5822 Heat Low viscosity potting material. Good release properties. Enquiry