Silicone Material Solutions for LED Packages and Assemblies - Die Attach Silicones - Dot Metrix and Assembly Materials - Glob Top Encapsulants - InvisiSil* LED Encapsulants - Lens Fabrication Materials
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Silicone Material Solutions for LED Packages and Assemblies
LED Packaging and Assembly Solutions from Momentive Performance Materials
The growth of optoelectronic devices and LEDs in segments such handheld devices, mobile phones, display backlights, automotive, and electronic signs, has led to an increase in demand for enhanced performance and long-term reliability. Designers of LEDs and optoelectronic devices will find a range of silicone material solutions from Momentive, that are excellent candidates to address a wide array of challenges facing the LED industry. |
Dot Metrix and Assembly Materials |
LED dot metrix potting materials are available in room temperature and heat-accelerated alternatives. The low viscosities of these potting materials make them excellent materials of choice for intricate Dot Matrix applications and LED Assemblies for viriety of industries ranging from signage, automotive, to lighting. These silicone materials provide enhanced weatherability performance, especially in locations with high salt air concentrations, and represent a smart alternative to conventional epoxy or urethane materials. |
Grade |
Cure Chemistry |
Feature |
Price |
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RTV615 |
Heat Cure |
RTV615, RTV655 and RTV656 silicone rubber compounds are clear liquids which cure at room temperature to high strength silicone rubber with the addition of curing agents. These two-component products are supplied with curing agent in matched kits which are designed for use at a convenient 10:1 ratio by weight. |
Enquiry | TSE3032 |
Heat Cure |
TSE3032 is a two-component, low viscosity, transparent silicone rubber designed for electrical and electronic potting. The product cures at room temperature or by low temperature heat to transparent elastic rubber with the addition of curing agents.
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Enquiry | TSE3033 |
Heat Cure |
TSE3033 is a two-component, transparent heat curable silicone rubber designed for electrical and electronic potting. TSE3033 adheres to various types of materials such as metals, plastics, glass and ceramics without the use of primers.
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Enquiry | XE12-B2543 |
Room Temp. |
Two-component, low viscosity encapsulant for LED Dot Matrix
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Enquiry | XE14-C0447 |
Heat Cure |
Two-component, heat cure encapsulant
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Enquiry | |