Silicone Material Solutions for LED Packages and Assemblies

- Die Attach Silicones
- Dot Metrix and Assembly Materials
- Glob Top Encapsulants
- InvisiSil* LED Encapsulants
- Lens Fabrication Materials

Silicone Material Solutions for LED Packages and Assemblies

LED Packaging and Assembly Solutions from Momentive Performance Materials The growth of optoelectronic devices and LEDs in segments such handheld devices, mobile phones, display backlights, automotive, and electronic signs, has led to an increase in demand for enhanced performance and long-term reliability. Designers of LEDs and optoelectronic devices will find a range of silicone material solutions from Momentive, that are excellent candidates to address a wide array of challenges facing the LED industry.

Glob Top Encapsulants
Momentive’s Glob Top encapsulants exhibit good light transmittance, and are excellent candidates to provide consistent dispensing performance and material flow to form a dome shape for COB (chip on board) encapsulation. Component designers with chip-mounting and wire-bonding capabilities can benefit from the process simplicity that these materials offer in LED COB packaging application.

Grade Cure
Chemistry		 Feature Price
XE13-C0810 Heat Cure One-component, light transmitting encapsulant for LED Enquiry
XE14-B3445 Heat Cure Two-component, thixotropic JCR rubber for adhesion / sealant Enquiry
XE14-B5778 Heat Cure N/A Enquiry